Sl. No. | Title of the Patent | Application Number | Date of Filing | Inventor / Applicant Name |
01. | Composition of a Thermal Conductive Adhesive Composite Comprising a Thermal Powder Filler | 201931008979 | 07.03.2019 | Central Institute of Petrochemicals Engineering & Technology (CIPET) |
02. | Mouldable Polymer Composites with Thermal Conductivity and EMI Shielding | 201931010082 | 15.03.2019 | Central Institute of Petrochemicals Engineering & Technology (CIPET) |
03. | Bio-based Absorbent Composition for Sanitary Napkin and its Preparation Thereof | 202231061640 | 28.10.2022 | Central Institute of Petrochemicals Engineering & Technology (CIPET) |
04. | Fused Deposition Modeling (FDM) 3D Printed Thermoplastic-Based Capacitors with Nanofiller Reinforcement and Method of Making | 202331073698 | 28.10.2023 | Central Institute of Petrochemicals Engineering & Technology (CIPET) |